Hybrid die-attach Solution Hybrid die-attach represents a convergence of advanced SMT and IC technologies. Equipment serving this market must be extremely flexible to bond many different components while applying two or more different epoxies, in a single pass. It must process the smallest to the largest, and also ultra-thin, die. Various single-pass component presentation methods are required and the equipment must work with many different substrate types. Key bond process parameters such as placement accuracy, bond-line thickness, die tilt, epoxy coverage and fillet, must be met.
In the fast-paced hybrid market, customized jobs are the order of the day. An equipment vendor should be in a position to accommodate these custom projects. For low volume/high mix production, a basic manual-load die-attach system will be sufficient. For high volume, or high-mix, production the dieattach system must be operable in-line with ovens, wire bonders, screen printers, laser markers, plasma cleaners, etc. Aadvanced Flip Chip Bonder by flip-chip-bonder.net |
